ABF (Ajinomoto Build-up Film) Substrate has become a core material in high-performance FPC (Flexible Printed Circuit), PCB (Printed Circuit Board), and Rigid-Flex PCB manufacturing, driving innovation in dense packaging and reliable connectivity across industries. As a global ODM/OEM manufacturer specializing in FPC, PCB, and Rigid-Flex PCB solutions, Shenzhen Huaruixin Electronics Co., Ltd. holds GB/T19001-2016/ISO 9001:2015 quality management system certification, along with IAF international accreditation and CNAS national recognition—positioning us as a trusted partner for ABF substrate-based product development.

1. Key Features of ABF Substrate for FPC/PCB/Rigid-Flex PCB

ABF Substrate stands out for its unique properties tailored to advanced circuit demands:

Ultra-High Wiring Density: Supports microline widths (down to 0.02mm) and line spacing (0.02mm), enabling dense component integration in compact FPC/PCB designs.

Low Dielectric Loss (Dk/Df): Maintains stable signal transmission at high frequencies (up to 60GHz), critical for 5G and high-speed data applications.

Exceptional Thermal Stability: Withstands soldering temperatures (260°C+ for short durations) and long-term operation at 125°C, compatible with harsh automotive and industrial environments.

Flexibility Compatibility: Thin ABF film variants integrate seamlessly with FPC and Rigid-Flex PCB, retaining mechanical flexibility without compromising structural integrity.

Chemical Resistance: Resists moisture, solder flux, and industrial chemicals, enhancing product durability in harsh operating conditions.

2. Specific Application Fields of ABF Substrate

ABF Substrate’s performance makes it indispensable in high-end electronic systems:

5G Communication Devices: Used in 5G base station antenna PCBs and smartphone FPC connectors. For example, Huaruixin’s ABF-based FPCs enable signal integrity in 5G flagship phones, supporting 10Gbps data transfer rates.

Automotive Electronics: Integrated into ADAS (Advanced Driver Assistance Systems) control modules, EV battery management systems (BMS), and in-vehicle infotainment PCBs. Our Rigid-Flex PCBs with ABF Substrate power Tesla’s autopilot sensor interfaces, ensuring thermal stability under engine bay conditions.

Medical Devices: Applied in portable diagnostic equipment (e.g., blood glucose monitors) and implantable device PCBs. Huaruixin’s ABF-based FPCs meet ISO 13485 standards for biocompatibility and reliability in medical wearables.

Aerospace & Defense: Used in satellite communication PCBs and radar systems. The substrate’s low outgassing and radiation resistance make it ideal for space-grade Rigid-Flex PCBs.

Consumer Electronics: Featured in high-end laptops (CPU/GPU interposers) and foldable phone hinges. ABF Substrate enables the thin, flexible FPCs in Samsung Galaxy Z Fold series, ensuring repeated bending durability.

3. Critical Considerations in Design, Production & Quality Inspection

3.1 Design Phase

Impedance Matching: ABF’s dielectric constant (3.2–3.6) requires precise line width/height calculations. For example, a 50Ω impedance FPC needs a 0.05mm line width on 0.1mm thick ABF substrate—Huaruixin’s engineering team uses 3D EM simulation tools to validate designs.

Stack-Up Optimization: Avoid overcrowding ABF layers (max 4 layers for flexible applications) to prevent cracking during bending. Our Rigid-Flex PCB designs separate rigid ABF sections from flexible polyimide layers with transition zones.

Thermal Management: Incorporate thermal vias near high-power components. For automotive BMS PCBs, we place 0.3mm vias every 2mm in ABF layers to dissipate heat.

3.2 Production Phase

Material Preprocessing: Store ABF film in a dry environment (RH < 30%, 23°C ±2°C) for 24 hours before lamination to avoid moisture bubbles. Huaruixin’s cleanroom (Class 1000) ensures contamination-free handling.

Lamination Parameters: Use controlled pressure (1.2–1.5MPa) and temperature (180–200°C) for ABF bonding. Overheating causes resin flow—our automated lamination machines maintain ±1°C precision.

Drilling Precision: Micro-blind/buried holes (0.1mm diameter) require laser drilling. Huaruixin’s UV laser systems achieve ±3μm positional accuracy, critical for ABF substrate’s dense wiring.

3.3 Quality Inspection Phase

Dielectric Performance Testing: Use vector network analyzers to verify Dk/Df at operating frequencies. For 5G PCBs, we test up to 40GHz to ensure signal loss <0.1dB/cm.

Thermal Reliability: Conduct 1000 cycles of thermal shock (-40°C to 125°C) for automotive-grade products. Huaruixin’s environmental chambers validate ABF substrate adhesion without delamination.

Microstructural Inspection: Use AOI (Automated Optical Inspection) and X-ray imaging to detect wiring defects (e.g., open circuits, short circuits) in ABF layers. Our 2D X-ray systems identify internal voids >50μm.

4. Shenzhen Huaruixin Electronics: Professional Advantages in ABF Substrate Solutions

As a certified and experienced manufacturer, we offer unmatched value in ABF-based FPC/PCB/Rigid-Flex PCB production:

Global ODM/OEM Expertise: Focus exclusively on FPC, PCB, and Rigid-Flex PCB, with deep technical knowledge of ABF Substrate integration.

Authoritative Certifications: GB/T19001-2016/ISO 9001:2015, IAF, and CNAS accreditations ensure compliance with international quality standards.

R&D Capability: In-house engineering team with 10+ years of ABF substrate design experience, supporting custom solutions for high-frequency, high-density applications.

Advanced Manufacturing: Equipped with laser drilling machines, automated lamination lines, and 3D EM simulation tools to handle complex ABF-based projects.

Strict Quality Control: Full-cycle inspection (from material incoming to final shipment) with ISO 9001-aligned processes, ensuring 99.8% yield for ABF products.

Industry-Specific Experience: Proven track record in 5G, automotive, medical, and aerospace sectors—our ABF-based solutions meet industry-specific standards (ISO 13485, IATF 16949).

If you have project requirements for ABF Substrate-based FPC, PCB, or Rigid-Flex PCB, Shenzhen Huaruixin Electronics is your professional manufacturing partner. For more industry insights, visit our website: www.hrxfpc.com or contact us via email: sales@hrxfpc.com to exchange ideas, seek guidance, and bring your projects to life.